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DIC 3D full-field strain measurement and analysis system

2021-03-18

DIC uses high-precision digital image correlation algorithms to provide experimenters with non-contact dynamic full-field three-dimensional strain and displacement measurement.

DIC 3D full-field strain measurement and analysis system


DIC technology can be used in ordinary indoor and outdoor environments. The strain measurement range is from 0.005% to 2000% or more. With different image acquisition hardware, the measurement object size can be from a few Square millimeter to tens of Square millimeter, and the larger measurement format can also be customized. In theory, as long as high-quality images can be obtained within this measurement range, accurate strain and deformation measurements can be performed.

The DIC three-dimensional full-field strain measurement and analysis system can be combined with the binocular stereo microscope technology to realize the measurement of the three-dimensional coordinates, displacement field and strain field of the surface during the deformation of small objects.

 

We have four series of products to provide you best solution. Below are specifications for our DIC CONTST for your reference first:

 DIC 3D full-field strain measurement and analysis system

 

For other models and more information, please contact your sales engineer. Thank you!

Tel : 0086-29-89589035

Web : www.mh-elec.com

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mh_elec@126.com or jacky@mh-elec.com


 


MHNV®️ Electronics Technology  Co.,Ltd


China Manufacturer and Supplier of Nght Vision & Thermal Imaging Devices

Address: Zhangba Street ONE high-tech, Xi'an City,Shaanxi Province, PRC.


WhatsApp:  + 86-18792456795

📞 Phone:   0086-29-89589035

Email: mh_elec@126.com (Click this email and send inquiry)